https://www.live-feeds.com/feed/apple-a20-pro-motherboard-leak-hints-at-notable-memory-and-packaging-upgradesContinuously updated, source-cited coverage. https://www.live-feeds.com/feed/apple-a20-pro-motherboard-leak-hints-at-notable-memory-and-packaging-upgradeshttps://www.live-feeds.com/feed/apple-a20-pro-motherboard-leak-hints-at-notable-memory-and-packaging-upgrades#u23934Sat, 04 Jul 2026 05:56:44 +0000Leaked images of an alleged iPhone 18 Pro motherboard suggest the A20 Pro chip will use TSMC's Wafer-Level Multi-Chip Module technology. This redesign aims to improve thermals and performance. The chip is also expected to feature LPDDR6 memory and a larger neural engine.What's confirmed:The A20 Pro chip is rumored to use TSMC's Wafer-Level Multi-Chip Module packaging architecture.The A20 Pro will likely feature LPDDR6 memory and a larger Neural Processing Unit.The iPhone 18 and iPhone 18e are expected to feature 9GB of RAM and the A20 chip.The A20 Pro packaging is designed to improve