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<rss version="2.0"><channel><title>SK Hynix to start AI chip output in Indiana in 2029, sees memory shortage through 2030 — Live Feed</title><link>https://www.live-feeds.com/feed/sk-hynix-to-start-ai-chip-output-in-indiana-in-2029-sees-memory-shortage-through-2030</link><atom:link xmlns:atom="http://www.w3.org/2005/Atom" href="https://www.live-feeds.com/feed/sk-hynix-to-start-ai-chip-output-in-indiana-in-2029-sees-memory-shortage-through-2030/rss.xml" rel="self" type="application/rss+xml"/><description>Continuously updated, source-cited coverage.</description>
<item><title>SK Hynix breaks ground on $4 billion Indiana HBM facility</title><link>https://www.live-feeds.com/feed/sk-hynix-to-start-ai-chip-output-in-indiana-in-2029-sees-memory-shortage-through-2030</link><guid isPermaLink="false">https://www.live-feeds.com/feed/sk-hynix-to-start-ai-chip-output-in-indiana-in-2029-sees-memory-shortage-through-2030#u56168</guid><pubDate>Thu, 03 Sep 2026 23:05:57 +0000</pubDate><description>SK Hynix has started construction on a $4 billion high bandwidth memory packaging plant in Indiana. The facility marks the company&amp;#039;s first advanced memory production hub in the United States and aims to meet AI-focused memory demand. Volume production of HBM4E chips is scheduled for the third quarter of 2029. CEO Kwak Noh-Jung expects the site to be a primary memory production base by 2030, as the company anticipates a global memory chip shortage will continue through the end of 2030.Why it mattersThe project aligns with US efforts to increase domestic semiconductor capacity. SK Hynix is </description></item>
<item><title>SK Hynix breaks ground on $4 billion AI memory facility in Indiana</title><link>https://www.live-feeds.com/feed/sk-hynix-to-start-ai-chip-output-in-indiana-in-2029-sees-memory-shortage-through-2030</link><guid isPermaLink="false">https://www.live-feeds.com/feed/sk-hynix-to-start-ai-chip-output-in-indiana-in-2029-sees-memory-shortage-through-2030#u51158</guid><pubDate>Sat, 29 Aug 2026 01:50:34 +0000</pubDate><description>SK Hynix has started construction on a more than $4 billion advanced packaging plant in Indiana&amp;#039;s Purdue Research Park. The facility will produce next-generation HBM4E chips, with volume production scheduled to begin in the third quarter of 2029. CEO Kwak Noh-Jung expects the site to become a key memory production base by 2030. This expansion comes as the company predicts a memory chip shortage will persist through the end of 2030, dismissing risks of an oversupply as AI investment continues to drive demand for high-bandwidth memory.Why it mattersHigh-bandwidth memory (HBM) is a critical </description></item>
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