https://www.live-feeds.com/feed/taiwan-breaks-ground-on-advanced-packaging-park-anchored-by-tsmcContinuously updated, source-cited coverage. https://www.live-feeds.com/feed/taiwan-breaks-ground-on-advanced-packaging-park-anchored-by-tsmchttps://www.live-feeds.com/feed/taiwan-breaks-ground-on-advanced-packaging-park-anchored-by-tsmc#u80572Tue, 22 Sep 2026 21:06:35 +0000Taiwan has broken ground on the Baipu Industrial Park in Kaohsiung, a semiconductor cluster anchored by TSMC and ASE. The project targets 25 hectares for advanced packaging equipment investment to support AI and high-performance computing chip production. The park aims to strengthen the semiconductor ecosystem through technology validation and talent training. President Lai stated the development will expand the chip cluster in southern Taiwan, focusing on suppliers for the post-Moore era.Why it mattersAdvanced packaging is critical for AI hardware as traditional chip scaling slows. This clust