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<rss version="2.0"><channel><title>TSMC, Samsung commit to ASML’s newest chipmaking tools as AI drives demand — Live Feed</title><link>https://www.live-feeds.com/feed/tsmc-samsung-commit-to-asml-s-newest-chipmaking-tools-as-ai-drives-demand</link><atom:link xmlns:atom="http://www.w3.org/2005/Atom" href="https://www.live-feeds.com/feed/tsmc-samsung-commit-to-asml-s-newest-chipmaking-tools-as-ai-drives-demand/rss.xml" rel="self" type="application/rss+xml"/><description>Continuously updated, source-cited coverage.</description>
<item><title>TSMC and Samsung Commit to ASML High NA EUV Tools for AI Chips</title><link>https://www.live-feeds.com/feed/tsmc-samsung-commit-to-asml-s-newest-chipmaking-tools-as-ai-drives-demand</link><guid isPermaLink="false">https://www.live-feeds.com/feed/tsmc-samsung-commit-to-asml-s-newest-chipmaking-tools-as-ai-drives-demand#u62403</guid><pubDate>Wed, 09 Sep 2026 06:11:39 +0000</pubDate><description>TSMC and Samsung have committed to using ASML&amp;#039;s latest High NA EUV lithography machines to meet surging demand for AI technology. The partnership focuses on creating denser transistors for AI chips and scaling DRAM. As part of a broader industry initiative, both chipmakers are transitioning to larger 12-inch photomasks. This shift aims to reduce semiconductor manufacturing costs by 2033. ASML is also working with these partners to utilize the tools for producing larger chips.Why it mattersHigh NA EUV machines are essential for the next generation of semiconductor manufacturing. These tool</description></item>
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