GENIO EVO Tackles Advanced Packaging
Thermal and Mechanical Roadblocks
ROME, Jan. 14, 2025 /PRNewswire/ — MZ Technologies, a leading supplier of innovative solutions and methodologies for 2.5 and 3D design, today unveiled GENIO EVO, the first integrated chiplet/package EDA tool to address in pre-layout stage the two major issues of 3D-IC design, thermal and mechanical stress. MZ will demonstrate this new tool at the Chiplet Summit, being held from January 21-23, 2025 at the Santa Clara Convention Center.
…