Catching Critical Defects In TSVs And Stacked Chips
Key Takeaways Variation becomes a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI can play a significant role in distinguishing between yield-killing and nuisance variations and significantly reduce false positives. New methods for interconnecting devices using through-silicon vias (TSVs) and hybrid bonding in stacked … Read more