chiplets

How Siemens Symphony Pro Enabled AnalogPort To Verify Complex Chip Interfaces

by

The semiconductor industry’s shift toward chiplet-based architectures has created significant mixed-signal verification challenges for high-speed die-to-die interconnects. Traditional verification approaches force difficult trade-offs: Digital mixed-signal (DMS) flows sacrifice analog fidelity, while Analog mixed-signal (AMS) flows struggle with scalability and manual overhead. This paper details how AnalogPort, a leading high-speed interconnect solutions provider, successfully addressed these … Read more

Catching Critical Defects In TSVs And Stacked Chips

by

Key Takeaways Variation becomes a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI can play a significant role in distinguishing between yield-killing and nuisance variations and significantly reduce false positives. New methods for interconnecting devices using through-silicon vias (TSVs) and hybrid bonding in stacked … Read more