Key Takeaways
- Variation becomes a bigger problem in multi-die assemblies with TSVs and hybrid bonding.
- Multi-modal approaches are required to test these devices.
- AI can play a significant role in distinguishing between yield-killing and nuisance variations and significantly reduce false positives.
New methods for interconnecting devices using through-silicon vias (TSVs) and hybrid bonding in stacked chips are exhibiting high levels of process variation, which complicates traditional defect inspection routines. Because these advanced packaging architectures lack maturity, identifying the best inspection method is more challenging than it was in the past.
The great diversity of packaging approaches increases the numbers and types of defects that need to be…